KDJ01-6
This specification covers " DIN JACK "
Standard atmospheric specified, measurements shall be made at temperature , humidity and air pressure within the following limit :
| Ambient temperature | ： | 5 | ℃ | to | 35 | ℃ |
| Relative humidity | ： | 45 | % | to | 85 | % |
| Air pressure | ： | 85 | Kpa | to | 106 | Kpa |
| Operating temperature range | ： | -20 | ℃ | to | 60 | ℃ |
| Storage temperature range | ： | -25 | ℃ | to | 70 | ℃ |
| ITEM | TEST CONDITIONS | SPECIFICATION |
|---|---|---|
| (C1) Rated Voltage Rated Current |
DC 24V 1A |
|
| (C2) Insulation Resistance |
A voltage of 500V DC shall be applied to the terminals. After which measurement shall be made.
DC 500V
|
100M Ω or more≧ 100M Ω |
| (C3) Contact Resistance |
Measurement shall be made at 1 K Hz with 100 mA or less (With the test plug as show in item G)
<1>Initial before any testing
Plug shield to socket
<2>After life test with mating Plug shield to socket
|
Initial： 30mΩ or Less≦ 30mΩ After life： 60mΩ or Less≦ 60mΩ |
| (C4) Dielectric Strength |
Withstand 0.5 mA (Trip current) 500V AC(50 or 60 Hz) between any open terminal for 1 minute. (Open terminal: Between each terminal which should not make contact , before plug insert to socket .) |
Without distinct Damage |
| ITEM | TEST CONDITIONS | SPECIFICATION |
|---|---|---|
| (D1) Insertion force and Withdrawal force | Initial ( With the test plug as show in item G ) |
Insertion force 0.5kgf ~ 5.5kgf |
| Withdrawal force 0.5kgf ~ 5.5kgf |
||
| After life test ( With the test plug as show in item G ) |
Insertion force 0.3kgf ~ 5.5kgf |
|
| Withdrawal force 0.3kgf ~ 5.5kgf |
||
| (D2) Terminal strength | Terminals must withstand a 500g minimum pull for 10 seconds before movement or break from housing occurs , but deformation of terminal is authorized . | |
| ITEM | TEST CONDITIONS |
|---|---|
| (E1) Life test | The life test shall consist of 5,000 cycles of insertion and withdrawal with test plug( Show in item G ), at a rate of 20 to 30 cycles per minute under no load . |
| (E2) Soldering test | The terminal of JACK tested shall be dipped into soldering flux or equivalent for 5 ~ 10 seconds and then immersed into molten solder Sn at 260 ± 5℃ for 3 ± 0.5 seconds , the coverage should more than 95% . |
| (E3) Soldering heat | The terminal for a printed circuit board . Temperature of solder : 260 ± 5℃ Dip time : 5 ± 1 seconds . |
| (E4) Hand Soldering Temperature | Temperature of solder：350 ± 10℃ Dip time : 3 ± 0.5 seconds . |
| ITEM | TEST CONDITIONS |
|---|---|
| The temperature peak withoutlead. | .jpg "proimages/pro/DIN___Mini_DIN_Jack/KDJ01-6/KDJ01-6(a).jpg") Pre-heating temperature is 25 ~ 120℃,for a duration about 80 seconds。 The peak temperature is 260℃, the duration for 10 seconds. |
